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Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding

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Journal of Materials Science Letters

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  1. Department of Mechanical Engineering, University of Waterloo, Waterloo, Ontario, Canada, N2L 3G1

    Y. Zhou

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  1. Y. Zhou
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Zhou, Y. Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding. Journal of Materials Science Letters 20, 841–844 (2001). https://doi.org/10.1023/A:1010914813875

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