Abstract
The formation and growth of intermetallic phases in the Ni-Al system during a novel joining process for Ni/Ni interconnections based on diffusion soldering has been studied. The Ni/Al/Ni bonds were accomplished by isothermal solidification and subsequent interdiffusion of Ni and Al in the Ni/Al/Ni joints held at a temperature of 720°C. Optical and scanning electron microscopy, electron probe microanalysis and X-ray diffraction analysis were used to characterize the microstructural changes as a function of the reaction time. The following phases appeared sequentially: liquid Al → Al3Ni → Al3Ni2 → AlNi (stoichiometric) → AlNi (Ni-rich) → AlNi3. At intermediate stages two to four phases coexisted. The NiAl phase occurred in two variants, namely a Ni-rich AlNi (60 at.% Ni) and stoichiometric AlNi. The joining process was completed after 30 h of reaction. Then only AlNi3 was present in the Ni/Al/Ni interconnection zone. The quality of the resultant bond and the high melting point of the AlNi3 phase (1360°C) indicate a great potential of the diffusion soldering for the joining of heat dissipating devices used in electronics and electrotechnics.
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López, G., Sommadossi, S., Gust, W. et al. Phase Characterization of Diffusion Soldered Ni/Al/Ni Interconnections. Interface Science 10, 13–19 (2002). https://doi.org/10.1023/A:1015172710411
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DOI: https://doi.org/10.1023/A:1015172710411