Abstract
We studied the dielectric properties (dielectric constant and loss factor) of epoxy molding compounds used for electronic packaging, as a function of frequency (100 Hz–100 kHz) and temperature (25–100 °C). Studies were performed for samples with different formulations (various silica and carbon black contents). At room temperature a loss peak is found at 50 kHz, whose intensity is enhanced by carbon black addition. Additional loss is detected below 1 kHz when the temperature is increased up to 100 °C. We also studied the influence of post-mold curing time (0–12 h at 165 °C) on the dielectric properties. The dielectric constant monotonically decreases with post-mold cure to level off to a minimum value for long post-cure durations. The loss factor first increases for short post-curing times, and then decreases as post-cure is continued. The origin of loss is discussed with reference to common relaxation processes observed in epoxy polymers.
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Gonon, P., Sylvestre, A., Teysseyre, J. et al. Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing. Journal of Materials Science: Materials in Electronics 12, 81–86 (2001). https://doi.org/10.1023/A:1011241818209
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DOI: https://doi.org/10.1023/A:1011241818209