Issue 3, 1997

Deposition of LaNiO3 thin films in an atomic layer epitaxy reactor

Abstract

LaNiO 3 thin films have been deposited in an atomic layer epitaxy (ALE) reactor, using La(thd) 3 , Ni(thd) 2 and ozone as reactants, thereby proving the feasibility of the ALE technique to produce films of ternary oxides. Depositions were made on Corning glass in the temperature range 150–450 °C. The growth conditions were studied and the growth rate showed a linear dependence on the number of cycles. At 400 °C the growth rate was 0.24–0.26 Å per cycle. The growth rate of the LaNiO 3 thin films was greatly influenced by the deposition temperature but in the temperature range 215–250 °C the growth saturated at 0.08 Å cycle -1 independent of the deposition temperature, thus indicating an ALE window. As-deposited thin films were amorphous but crystallized when heated at 600 °C. Simultaneously the colour of the films changed from yellow–brown to black. Possible reasons for the colour changes are discussed. Resistivity measurements showed that the crystalline thin films were metallic, ρ=(5–20)×10 -6 Ω m. The amorphous thin films had resistivity values five orders of magnitude larger, ρ>3 Ω m. According to scanning electron microscopy (SEM) and atomic force microscopy (AFM), the films were homogeneous and dense. The surface roughness increased on crystallisation. X-Ray photoelectron spectroscopy (XPS) and magnetic susceptibility measurements were employed in order to further characterize the amorphous and crystalline thin films.

Article information

Article type
Paper

J. Mater. Chem., 1997,7, 449-454

Deposition of LaNiO3 thin films in an atomic layer epitaxy reactor

H. Seim, H. Mölsä, M. Nieminen, H. Fjellvåg and L. Niinistö, J. Mater. Chem., 1997, 7, 449 DOI: 10.1039/A606316K

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