Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Tetsu Yonezawa; Hiroki Tsukamoto; Yingqiong Yong; Mai Thanh Nguyen; Masaki Matsubara

doi:10.1039/C5RA25058G

You do not have JavaScript enabled. Please enable JavaScript to access the full features of the site or access our non-JavaScript page.

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu²⁺-alkanolamine metallacycle compounds for electrically conductive layer formation†

Tetsu Yonezawa,*^a Hiroki Tsukamoto,^a Yingqiong Yong,^a Mai Thanh Nguyen^a and Masaki Matsubara ‡^a

Author affiliations

* Corresponding authors

^a Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita 13 Nishi 8, Kita-ku, Sapporo, Hokkaido 060-8628, Japan
E-mail: tetsu@eng.hokudai.ac.jp

Abstract

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal–organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10⁻⁶ Ω m). This novel process may open a new strategy in the field of printed electronics.

Download options Please wait...

Supplementary files

Supplementary information PDF (331K)

Article information

DOI: https://doi.org/10.1039/C5RA25058G
Article type: Communication
Submitted: 25 Nov 2015
Accepted: 13 Jan 2016
First published: 18 Jan 2016
This article is Open Access

Download Citation

RSC Adv., 2016,6, 12048-12052

Author version available

Download author version (PDF)

Permissions

Request permissions

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu²⁺-alkanolamine metallacycle compounds for electrically conductive layer formation

T. Yonezawa, H. Tsukamoto, Y. Yong, M. T. Nguyen and M. Matsubara, RSC Adv., 2016, 6, 12048 DOI: 10.1039/C5RA25058G

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

Social activity

Fetching data from CrossRef.
This may take some time to load.

RSC Advances