Issue 4, 2006
From the journal:

Lab on a Chip

Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization

Kwan Seop Lim,ab   Woo-Jin Chang,b   Yoon-Mo Koobc  and  Rashid Bashir*a  

* Corresponding authors

a Birck Nanotechnology Center and Bindley Bioscience Center, School of Electrical and Computer Engineering, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, United States
E-mail: bashir@purdue.edu
Fax: 1-765-494-6441
Tel: 1-765-496-6229

b ERC for Advanced Bioseparation Technology, Inha University, Incheon 402-751, Republic of Korea

c Department of Biological Engineering, Inha University, Incheon 402-751, Republic of Korea

Abstract

We have developed a reliable fabrication method of forming micron scale metal patterns on poly(dimethylsiloxane) (PDMS) using a pattern transfer process. A metal stack layer consisting of Au–Ti–Au layers, providing a weak but reliable adhesion, was deposited on a silicon wafer. The metal stack layer was then transferred to a PDMS substrate using serial and selective etching. We demonstrate that features as small as 2 µm were reliably transferred on to the PDMS substrate for use as interconnects and electrodes for biosensors and flexible electronics application.

Graphical abstract: Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization

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Article information

DOI
https://doi.org/10.1039/B514755G
Article type
Technical Note
Submitted
18 Oct 2005
Accepted
20 Feb 2006
First published
10 Mar 2006

Lab Chip, 2006,6, 578-580

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Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization

K. S. Lim, W. Chang, Y. Koo and R. Bashir, Lab Chip, 2006, 6, 578 DOI: 10.1039/B514755G

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