SCHEDULED MAINTENANCE
Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices†
Abstract
Constructing a microsystem compatible with a large variety of chemistries requires a system design that will be robust in the presence of different compounds and at a wide range of conditions. Although microreactors themselves can accommodate a great span of conditions, few packaging schemes are compatible with cryogenic temperatures, high pressures, and aggressive organic solvents. Solder-based connections are designed and implemented on silicon-based microreactors and are demonstrated to withstand elevated pressures (up to 200 atm), a wide range of temperatures (−78 to 160 °C) and a variety of solvent systems. Through the deposition of metal bonding pads directly onto silicon and glass surfaces, solder-based chip-to-tube connections can be reliably formed using handheld soldering tools. Packaging techniques are also described for fluidic chip-to-chip bonds, facilitating direct connection of microfluidic modules. This method greatly expands the utility of microfluidic reactors while enabling easy and reproducible fluidic packaging.
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