Issue 9, 2010

Metalorganic chemical vapor deposition of non-GST chalcogenide materials for phase change memory applications

Abstract

The feasibility of InSbTe (IST) chalcogenide new materials by metalorganic chemical vapor deposition (MOCVD) was demonstrated for PRAM applications. IST-MOCVD at a low temperature of 250 °C resulted in a favorable conformal deposition in the trench structure with a high aspect ratio. The IST films grown at 250 °C showed the highest resistance of approximately 108 Ω/sq, suggesting the amorphous phase of IST and the films grown at 300 °C include various crystalline phases of IST, In–Sb, and In–Te. MOCVD-IST films exhibited a step-coverage of about 95% in the trench structure with a 5 : 1 aspect ratio (a height of 500 nm and a diameter of 100 nm) and also showed reliable filling of the trench under appropriate deposition conditions. Phase switching between amorphous and crystalline states in the IST films grown on a trench structure at a high-aspect ratio (3.5 : 1) was demonstrated showing functional characteristics for applications in memory devices. The IST-based chalcogenide films used included various crystallized phases of In–Sb–Te, In–Sb and In–Te, which proved to be favorable for multilevel data storage.

Graphical abstract: Metalorganic chemical vapor deposition of non-GST chalcogenide materials for phase change memory applications

Article information

Article type
Paper
Submitted
27 Oct 2009
Accepted
30 Nov 2009
First published
13 Jan 2010

J. Mater. Chem., 2010,20, 1751-1754

Metalorganic chemical vapor deposition of non-GST chalcogenide materials for phase change memory applications

J. Ahn, K. Park, S. Hur, N. Seong, C. Kim, J. Lee and S. Yoon, J. Mater. Chem., 2010, 20, 1751 DOI: 10.1039/B922398C

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