SCHEDULED MAINTENANCE
Formation and thermal stability of copper and nickel nitrides
Abstract
The formation and thermal stability of copper nitride and nickel nitride have been studied by thermoanalytical methods. Copper and nickel nitride formation by interaction of ammonia with the metal powders has been observed at atmospheric pressure in the temperature range 450–650 K. Copper nitride was stable at temperatures < 600 K in both nitrogen and ammonia atmospheres; in these atmospheres nickel nitride was stable at temperatures < ca. 680 K. In a hydrogen atmosphere, the copper nitride was stable at temperatures < 380 K and the nickel nitride at < 430 K. The decomposition of copper nitride in a nitrogen atmosphere was exothermic by –88 ± 5 kJ mol–1. Nickel nitride, in nitrogen, decomposed in two observable steps: the first step was endothermic by 2.5 ± 0.1 kJ mol–1 and the second step was exothermic by –7.5 ± 0.4 kJ mol–1.
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