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The application of lumped element techniques to high frequency hybrid integrated circuits

The application of lumped element techniques to high frequency hybrid integrated circuits

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Lumped element techniques as employed in a production range of high-frequency hybrid power amplifiers are described in the first part of this paper. The lumped inductor is a component not commonly employed for integrated circuits and such an application requires novel design considerations. In the second part, some of these are identified from the theory of lumped inductors and compared with the practical case.

References

    1. 1)
      • F.E. Terman . (1943) , Radio Engineer's Handbook.
    2. 2)
      • J.R. Corkhill , D.R. Mullins . The properties of thick film inductors. Electronic Component , 5
    3. 3)
      • C.S. Aitcheson . Lumped microwave circuits. Design Electronic , 1 , 30 - 39
    4. 4)
      • H. Sobol . Technology and design of hybrid microwave integrated circuits. Solid State Technology , 2 , 49 - 57
    5. 5)
      • M. Caulton , S.P. Knight , D.A. Daly . Hybrid integrated lumped-element microwave amplifiers. IEEE Trans. on Microwave Theory and Techniques , 7 , 397 - 404
    6. 6)
      • J.M.C. Duckes . (1961) , Printed Circuits, Their Design and Application.
    7. 7)
      • J.D. Cockcroft . Skin effect in rectangular conductors at high frequency. Proc. R. Soc. , 533 - 542
    8. 8)
      • F.Z. Keister . An evaluation of materials and processes for integrated microwave circuits. IEEE Trans. , 7 , 469 - 475
    9. 9)
      • A. Uhlir . Microwave applications of integrated circuit techniques. Proc. Inst. Elect. Electronics Engrs , 12 , 1617 - 1623
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