Analysis of out-of-plane thermal microactuators

Out-of-plane thermal microactuators find applications in optical switches to motivate micromirrors. Accurate analysis of such actuators is beneficial for improving existing designs and constructing more energy efficient actuators. However, the analysis is complicated by the nonlinear deformation of the thermal actuators along with temperature-dependent properties of polysilicon. This paper describes the development, modeling issues and results of a three-dimensional multiphysics nonlinear finite element model of surface micromachined out-of-plane thermal actuators. The model includes conductive and convective cooling effects and takes into account the effect of variable air gap on the response of the actuator. The model is implemented to investigate the characteristics of two diverse MUMPs fabricated out-of-plane thermal actuators. Reasonable agreement is observed between simulated and measured results for the model that considers the influence of air gap on actuator response. The usefulness of the model is demonstrated by implementing it to observe the effect of actuator geometry variation on steady-state deflection response.