Copper–micrometer-sized diamond nanostructured composites

Reinforcement of a copper matrix with diamond enables tailoring the properties demanded for thermal management applications at high temperature, such as the ones required for heat sink materials in low activated nuclear fusion reactors. For an optimum compromise between thermal conductivity and mechanical properties, a novel approach based on multiscale diamond dispersions is proposed: a Cu–nanodiamond composite produced by milling is used as a nanostructured matrix for further dispersion of micrometer-sized diamond (μDiamond). A series of Cu–nanodiamond mixtures have been milled to establish a suitable nanodiamond fraction. A refined matrix with homogeneously dispersed nanoparticles was obtained with 4 at.% μDiamond for posterior mixture with microdiamond and subsequent consolidation. Preliminary consolidation by hot extrusion of a mixture of pure copper and μDiamond has been carried out to define optimal processing parameters. The materials produced were characterized by x-ray diffraction, scanning and transmission electron microscopy and microhardness measurements.