Thermophoretic motion behavior of submicron particles in boundary-layer-separation flow around a droplet

Ao Wang, Qiang Song, Bingqiang Ji, and Qiang Yao
Phys. Rev. E 92, 063031 – Published 30 December 2015

Abstract

As a key mechanism of submicron particle capture in wet deposition and wet scrubbing processes, thermophoresis is influenced by the flow and temperature fields. Three-dimensional direct numerical simulations were conducted to quantify the characteristics of the flow and temperature fields around a droplet at three droplet Reynolds numbers (Re) that correspond to three typical boundary-layer-separation flows (steady axisymmetric, steady plane-symmetric, and unsteady plane-symmetric flows). The thermophoretic motion of submicron particles was simulated in these cases. Numerical results show that the motion of submicron particles around the droplet and the deposition distribution exhibit different characteristics under three typical flow forms. The motion patterns of particles are dependent on their initial positions in the upstream and flow forms. The patterns of particle motion and deposition are diversified as Re increases. The particle motion pattern, initial position of captured particles, and capture efficiency change periodically, especially during periodic vortex shedding. The key effects of flow forms on particle motion are the shape and stability of the wake behind the droplet. The drag force of fluid and the thermophoretic force in the wake contribute jointly to the deposition of submicron particles after the boundary-layer separation around a droplet.

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  • Received 26 August 2015

DOI:https://doi.org/10.1103/PhysRevE.92.063031

©2015 American Physical Society

Physics Subject Headings (PhySH)

Fluid Dynamics

Authors & Affiliations

Ao Wang, Qiang Song*, Bingqiang Ji, and Qiang Yao

  • Key Laboratory of Thermal Science and Power Engineering of Ministry of Education, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China

  • *Corresponding author: qsong@tsinghua.edu.cn

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Issue

Vol. 92, Iss. 6 — December 2015

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