Interfacial reaction and Fermi level movement induced by sequentially deposited metals on GaN: Au/Ni/GaN

Min-Ho Kim, Sung-Nam Lee, Chul Huh, Serng Yerl Park, Jeong Yeul Han, Jae Myung Seo, and Seong-Ju Park
Phys. Rev. B 61, 10966 – Published 15 April 2000
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Abstract

The interfacial reaction and Fermi-level movement, which are induced by thin and uniform Ni and Au layers, were investigated in situ using synchrotron photoemission spectroscopy. The study showed that the GaN surface layer was instantly disrupted as the result of Ni deposition, and the dissociated N and Ga were localized at the interface without the formation of any specific nitride species. The two Fermi levels of n- and p-type GaN were simultaneously located near 1.9 eV above the valence-band maximum, where the high-density gap states were generated by Ni deposition. The uniform Au layer deposited over the Ni layer tended to form an alloy with Ni as well as Ga atoms, but did not alter the band bending. A postannealing process enhanced those interfacial reactions, resulting in the segregation of Ga to the surface.

  • Received 8 March 1999

DOI:https://doi.org/10.1103/PhysRevB.61.10966

©2000 American Physical Society

Authors & Affiliations

Min-Ho Kim, Sung-Nam Lee, and Chul Huh

  • Department of Materials Science and Engineering & Center for Electronic Materials Research, Kwangju Institute of Science and Technology, Kwangju 500-712, Korea

Serng Yerl Park, Jeong Yeul Han, and Jae Myung Seo

  • Department of Physics, Jeonbuk National University, Jeonju 561-756, Korea

Seong-Ju Park*

  • Department of Materials Science and Engineering & Center for Electronic Materials Research, Kwangju Institute of Science and Technology, Kwangju 500-712, Korea

  • *Author to whom correspondence should be addressed. Electronic address: sjpark@kjist.ac.kr

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Vol. 61, Iss. 16 — 15 April 2000

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