Grain-boundary sliding in nanocrystalline fcc metals

H. Van Swygenhoven and P. M. Derlet
Phys. Rev. B 64, 224105 – Published 20 November 2001
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Abstract

Molecular-dynamics computer simulations of a model Ni nanocrystalline sample with a mean grain size of 12 nm under uniaxial tension is reported. The microscopic view of grain-boundary sliding is addressed. Two atomic processes are distinguished in the interfaces during sliding: atomic shuffling and stress-assisted free-volume migration. The activated accommodation processes under high-stress and room-temperature conditions are grain-boundary and triple-junction migration, and dislocation activity.

  • Received 8 March 2001

DOI:https://doi.org/10.1103/PhysRevB.64.224105

©2001 American Physical Society

Authors & Affiliations

H. Van Swygenhoven and P. M. Derlet

  • Paul Scherrer Institute, 5232 Villigen, Switzerland

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Issue

Vol. 64, Iss. 22 — 1 December 2001

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