Microstructural and magnetic evolution upon annealing of giant magnetoresistance melt-spun Co-Cu granular alloys

A. García Prieto, M. L. Fdez-Gubieda, C. Meneghini, A. García-Arribas, and S. Mobilio
Phys. Rev. B 67, 224415 – Published 13 June 2003
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Abstract

This paper reports a thorough microstructural and magnetic analysis performed on as-quenched and annealed melt-spun CoxCu100x granular alloys presenting giant magnetoresistance. The use of three different techniques has been necessary to follow the evolution of the Co atoms with the thermal treatment. X-ray diffraction (XRD) detects the fraction of the Co atoms which are arranged in nanometric clusters. From the analysis of the hysteresis loops we have identified three different Co arrangements, each one with a different magnetic response: Co superparamagnetic nanoclusters, a Co-rich ferromagnetic phase, previously detected by XRD, and Co atoms diluted into the Cu matrix with no magnetic contribution. Finally, by means of the extended x-ray absorption fine structure spectroscopic technique performed on the Co K edge, we have analyzed the local configuration of the Co atoms, in particular, at the interfaces between the magnetic nanoclusters and the Cu matrix. Using the information gathered with these techniques, the microstructural evolution has been correlated to the giant magnetoresistance response of the CoCu system.

  • Received 5 November 2002

DOI:https://doi.org/10.1103/PhysRevB.67.224415

©2003 American Physical Society

Authors & Affiliations

A. García Prieto1,*, M. L. Fdez-Gubieda1, C. Meneghini2,3, A. García-Arribas1, and S. Mobilio3,4

  • 1Departamento de Electricidad y Electrónica. Universidad del País Vasco, Apartado 644, 48080 Bilbao, Spain
  • 2Istituto Nazionale di Fisica della Materia (INFM), c/o ESRF GILDA CRG, Boîte Postal 220, F-38043 Grenoble, France
  • 3Dipartimento di Fisica “E. Amaldi,” Universitá di Roma Tre, Via della Vasca Navale 84, I-00146 Roma, Italy
  • 4Laboratori Nazionali di Frascati (INFN), P.O. Box 13, I-00044 Frascati, Italy

  • *Email address: agp@we.lc.ehu.es

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Vol. 67, Iss. 22 — 1 June 2003

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