Ab initio study of self-diffusion in silicon over a wide temperature range: Point defect states and migration mechanisms

Shangyi Ma and Shaoqing Wang
Phys. Rev. B 81, 193203 – Published 12 May 2010

Abstract

We identified the states of intrinsic point defects underlying the self-diffusion in Si and clarified the change of dominant diffusion mechanism responsible for the self-diffusion over a wide temperature range using ab initio method. We presented a reliable self-diffusion model that the mechanisms of vacancies and self-interstitials dominate below and above 1220 K, respectively. Our calculations provided a clear picture of Si self-diffusion at lower and higher temperature ascribed to single point defects rather than extended defects. The calculations also provided valuable information on the energy levels and the thermal equilibrium concentrations of point defects, which are highly controversial in experimental reports due to detection limits.

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  • Received 4 April 2010

DOI:https://doi.org/10.1103/PhysRevB.81.193203

©2010 American Physical Society

Authors & Affiliations

Shangyi Ma1,2 and Shaoqing Wang1

  • 1Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
  • 2Graduate University, Chinese Academy of Sciences, Beijing 100049, China

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Issue

Vol. 81, Iss. 19 — 15 May 2010

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