Abstract
The dynamics of a strain-induced resistive phase transition in a thin film was studied by using a low-frequency crystal bending stage. It was found that the resistance response of the film to strain excitation is determined by two time constants, interpreted as a nucleation lifetime, in the range, and a domain growth lifetime of . The variation of the domain nucleation lifetime is discussed in terms of the barrier height separating the coexisting insulating and metallic phases in a film. Below the transition temperature, the phase transition is nucleation limited. Above the transition temperature, the resistance change is strongly affected by the growth of metallic domains. Direct imaging of metallic domains by local-probe current mapping showed that the phase transition in a thin film is limited by the presence of grain boundaries.
- Received 17 May 2010
DOI:https://doi.org/10.1103/PhysRevB.82.144113
©2010 American Physical Society