Universal enthalpy-entropy compensation rule for the deformation of metallic glasses

Yun-Jiang Wang, Meng Zhang, Lin Liu, Shigenobu Ogata, and L. H. Dai
Phys. Rev. B 92, 174118 – Published 23 November 2015
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Abstract

The thermodynamic compensation law describing an empirical linear relationship between activation enthalpy and activation entropy has seldom been validated for amorphous solids. Here molecular dynamics simulations reveal a well-defined enthalpy-entropy compensation rule in a metallic glass (MG) over a wide temperature and stress range, spanning the glass transition induced by temperature and/or stress. Experiments on other MGs reproduce this law, suggesting that it applies universally to amorphous solids, so we extend it from crystals to amorphous solids. In the glassy state, the compensation temperature is found to agree with the thermal glass transition temperature Tg; whereas in the supercooled liquid region, the compensation temperature matches 1.4Tg, at which the diffusion kinetics start to feel the roughness of the free-energy surface.

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  • Received 3 July 2014
  • Revised 14 October 2015
  • Corrected 1 December 2015

DOI:https://doi.org/10.1103/PhysRevB.92.174118

©2015 American Physical Society

Corrections

1 December 2015

Erratum

Publisher's Note: Universal enthalpy-entropy compensation rule for the deformation of metallic glasses [Phys. Rev. B 92, 174118 (2015)]

Yun-Jiang Wang, Meng Zhang, Lin Liu, Shigenobu Ogata, and L. H. Dai
Phys. Rev. B 92, 219902 (2015)

Authors & Affiliations

Yun-Jiang Wang1,*, Meng Zhang1,2, Lin Liu2, Shigenobu Ogata3,4,†, and L. H. Dai1,‡

  • 1State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
  • 2School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
  • 3Graduate School of Engineering Science, Osaka University, Osaka 560-8531, Japan
  • 4Center for Elements Strategy Initiative for Structural Materials (ESISM), Kyoto University, Sakyo, Kyoto 606-8501, Japan

  • *yjwang@imech.ac.cn
  • ogata@me.es.osaka-u.ac.jp
  • lhdai@lnm.imech.ac.cn

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Issue

Vol. 92, Iss. 17 — 1 November 2015

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