Insulator-Metal Transition and Topological Superconductivity in UTe2 from a First-Principles Calculation

Jun Ishizuka, Shuntaro Sumita, Akito Daido, and Youichi Yanase
Phys. Rev. Lett. 123, 217001 – Published 19 November 2019
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Abstract

We theoretically study superconductivity in UTe2, which is a recently discovered strong candidate for an odd-parity spin-triplet superconductor. Theoretical studies for this compound faced difficulty because first-principles calculations predict an insulating electronic state, incompatible with superconducting instability. To overcome this problem, we take into account electron correlation effects by a GGA+U method and show the insulator-metal transition by Coulomb interaction. Using Fermi surfaces obtained as a function of U, we clarify topological properties of possible superconducting states. Fermi surface formulas for the three-dimensional winding number and three two-dimensional Z2 numbers indicate topological superconductivity at an intermediate U for all the odd-parity pairing symmetry in the Immm space group. Symmetry and topology of superconducting gap nodes are analyzed and the gap structure of UTe2 is predicted. Topologically protected low-energy excitations are highlighted, and experiments by bulk and surface probes are proposed to link Fermi surfaces and pairing symmetry. Based on the results, we also discuss multiple superconducting phases under magnetic fields, which were implied by recent experiments.

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  • Received 16 August 2019

DOI:https://doi.org/10.1103/PhysRevLett.123.217001

© 2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Jun Ishizuka, Shuntaro Sumita, Akito Daido, and Youichi Yanase

  • Department of Physics, Graduate School of Science, Kyoto University, Kyoto 606-8502, Japan

See Also

Quasi-Two-Dimensional Fermi Surfaces and Unitary Spin-Triplet Pairing in the Heavy Fermion Superconductor UTe2

Yuanji Xu, Yutao Sheng, and Yi-feng Yang
Phys. Rev. Lett. 123, 217002 (2019)

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Vol. 123, Iss. 21 — 22 November 2019

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