Mechanism of HF etching of silicon surfaces: A theoretical understanding of hydrogen passivation

G. W. Trucks, Krishnan Raghavachari, G. S. Higashi, and Y. J. Chabal
Phys. Rev. Lett. 65, 504 – Published 23 July 1990
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Abstract

Ab initio molecular-orbital theory is used to unravel the mechanism of HF etching leading to hydrogen-passivated silicon surfaces as observed experimentally. Total-energy calculations on transition states of model silicon compounds suggest that the activation barriers for HF attack of the Si surface determine the resulting surface termination. In particular, the H passivation results from efficient removal of fluorine-bonded surface silicon as SiF4 leaving behind hydrogen.

  • Received 20 February 1990

DOI:https://doi.org/10.1103/PhysRevLett.65.504

©1990 American Physical Society

Authors & Affiliations

G. W. Trucks, Krishnan Raghavachari, G. S. Higashi, and Y. J. Chabal

  • AT&T Bell Laboratories, Murray Hill, New Jersey 07974

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Vol. 65, Iss. 4 — 23 July 1990

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