Microstructural evolution in direct laser sintering of Cu‐based metal powder

To identify the effects of laser scan speed and scan spacing on surface morphology, microstructure and structure evolution in direct laser sintering of Cu‐based metal powder.

Scanning electron microscope, differential thermal analyser (DTA) and X‐ray diffractometer were used to examine the microstructure of the sintered parts.

It was found that the decrease of the scan speed and scan spacing could lead to densification due to solute‐reprecipitation mechanism. The formation of oxide Cu₂O is sensitive to the scan spacing due to the lack of Cu₃P protection under the re‐heating condition if using small scan spacing. Furthermore, the result shows that there exist two mechanisms in determining the phosphor distribution. During the laser sintering, concentration diffusion acts as the main mechanism at a fast scan speed and a large scan spacing while solute‐reprecipitation acts as the main mechanism at a low scan speed and small scan spacing.

This paper discloses the influence of process parameters on microstructure evolution and the mechanism of densification in direct laser sintering Cu‐based metal powder. It offers practical help to the researchers who are interested in direct laser sintering metal powder.