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Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes

Hao Zhang (School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China)
Yang Liu (School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China)
Fenglian Sun (School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China)
Gaofang Ban (School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China)
Jiajie Fan (Changzhou Institute of Technology Research for Solid State Lighting, Changzhou, China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 3 January 2017

189

Abstract

Purpose

This paper aimed to investigate the effects of nano-copper particles on the melting behaviors, wettability and defect formation mechanism of the Sn58Bi composite solder pastes.

Design/methodology/approach

In this paper, the mechanical stirring method was used to get the nano-composite solder pastes.

Findings

Experimental results indicated that the addition of 3 wt.% (weight percentage) 50 nm copper particles showed limited effects on the melting behaviors of the Sn58Bi composite solder paste. The spreading rate of the Sn58Bi composite solder paste showed a decreasing trend with the increase of the weight percentage of 50 nm copper particles from 0 to 3 wt.%. With the addition of copper particles of diameters 50 nm, 500 nm or 6.5 μm into the Sn58Bi solder paste, the porosities of the three types of solder pastes showed a similar trend. The porosity increased with the increase of the weight percentage of copper particles. Based on the experimental results, a model of the void formation mechanism was proposed. During reflow, the copper particles reacted with Sn in the matrix and formed intermetallic compounds, which gathered around the voids produced by the volatilization of flux. The exclusion of the voids was suppressed and eventually led to the formation of defects.

Originality/value

This study provides an optimized material for the second and third level packaging. A model of the void formation mechanism was proposed.

Keywords

Acknowledgements

The authors would like to thank the support of National Natural Science Foundation of China (51174069), Research and Scientific Foundation of Heilongjiang Education Department (No. 12541112), University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province (UNPYSCT-2015042), and the the National High Technology Research and Development Program of China (863 Program) (No. 2015AA033304).

Citation

Zhang, H., Liu, Y., Sun, F., Ban, G. and Fan, J. (2017), "Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes", Microelectronics International, Vol. 34 No. 1, pp. 40-44. https://doi.org/10.1108/MI-02-2016-0013

Publisher

:

Emerald Group Publishing Limited

Copyright © 2017, Emerald Publishing Limited

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