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Growth behaviors of tin whisker in RE‐doped Sn‐Zn‐Ga solder

Huan Ye (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Songbai Xue (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Cheng Chen (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Yang Li (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 21 June 2013

166

Abstract

Purpose

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The purpose of this paper is to investigate the growth behavior and mechanism of Sn whisker induced by RE addition in Sn‐Zn‐Ga‐Pr solder at ambient condition.

Design/methodology/approach

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By means of aging treatment, FIB and SEM microstructure analysis, the whisker growth behavior was investigated.

Findings

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It was found that the morphologies of tin whisker are changed during air exposure. After 60 days aging, the average length of the longest whiskers could reach up to 70 μm, some whiskers even can grow to a length of 100 μm. It was discussed that the oxidation of Pr‐Sn intermetallics provides driving force for whisker growth.

Originality/value

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Tin whisker growth is a complex reliability issue for lead‐free solder. The current research can be helpful in re‐understanding the issue of tin whisker growth as well as an enriched understanding on the effects of REs on lead‐free solders.

Keywords

Citation

Ye, H., Xue, S., Chen, C. and Li, Y. (2013), "Growth behaviors of tin whisker in RE‐doped Sn‐Zn‐Ga solder", Soldering & Surface Mount Technology, Vol. 25 No. 3, pp. 139-144. https://doi.org/10.1108/SSMT-01-2013-0002

Publisher

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Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited

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