A practical approach to LWIR wafer-level optics for thermal imaging systems

Alan Symmons; Ray Pini

doi:10.1117/12.2015254

18 June 2013 A practical approach to LWIR wafer-level optics for thermal imaging systems

Alan Symmons, Ray Pini

Proceedings Volume 8704, Infrared Technology and Applications XXXIX; 870425 (2013) https://doi.org/10.1117/12.2015254
Event: SPIE Defense, Security, and Sensing, 2013, Baltimore, Maryland, United States

Abstract

The development and implementation of wafer level packaging for commercial microbolometers has opened the pathway towards full wafer-based thermal imaging systems. The next challenge in development is moving from discrete element LWIR imaging systems to a wafer based optical system, similar to lens assemblies found in cell phone cameras. This paper will compare a typical high volume thermal imaging design manufactured from discrete lens elements to a similar design optimized for manufacture through a wafer based approach. We will explore both performance and cost tradeoffs as well as review the manufacturability of all designs.

Citation Download Citation

Alan Symmons and Ray Pini "A practical approach to LWIR wafer-level optics for thermal imaging systems", Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 870425 (18 June 2013); https://doi.org/10.1117/12.2015254

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