Paper
16 January 2019 Characteristic of bound-abrasive polishing for fused silica glass in anhydrous environment
Wen Jun Liu, Wei Yang, Yin Biao Guo
Author Affiliations +
Proceedings Volume 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 1083808 (2019) https://doi.org/10.1117/12.2504799
Event: Ninth International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT2018), 2018, Chengdu, China
Abstract
To overcome the randomness of free abrasive polishing, the abrasive waste, the resulting hydration layer and other issues, this paper presents the characteristic of bound abrasive polishing for fused silica glass in anhydrous environment. A stable sintering process with a fine grooved polishing wheel is developed, which is applied to polish the fused silica glass. Macroscopically, the influence of pressure and rotational speed on the removal rate and surface roughness is explored. Microscopically, the mechanism of material removal, the chemical reaction and the mechanical action produced by the removal process are expounded by using EDS, XRD and FTIR analysis. The removal rate does not follow the Preston formula, temperature rise and the capacity of chip removal on the polishing wheel are the key factors. Furthermore, the experimental results show that the Ce-O-Si bond is formed by CeO2 abrasive grains and fused silica under the action of normal force. The bond energy is larger than that of fused silica Si-O-Si bond, so the CeO2 tears away SiO2 out of the glass surface under the action of shear force.
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Wen Jun Liu, Wei Yang, and Yin Biao Guo "Characteristic of bound-abrasive polishing for fused silica glass in anhydrous environment", Proc. SPIE 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 1083808 (16 January 2019); https://doi.org/10.1117/12.2504799
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KEYWORDS
Polishing

Silica

Abrasives

Glasses

Cerium

Surface finishing

FT-IR spectroscopy

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