Paper
28 September 2001 Direct spray coating of photoresist for MEMS applications
Nga Phuong Pham, Tom L.M. Scholtes, Ruud Klerk, Bernhard Wieder, Pasqualina M. Sarro, Joachim N. Burghartz
Author Affiliations +
Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442960
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
Direct spray coating, a new photoresist deposition technique, is investigated to evaluate its potential for pattern transfer on wafers with very large topography. An Electronic Vision EV101 spray coating system is employed and AZ4823 photoresist is selected to form a thick layer of resist on flat wafers and to produce sufficient coverage on wafers with deep cavities. The dependence of the resist thickness on the dispensed volume of the resist is studied. A few key parameters are optimized to achieve a uniform resist layer. Special attention is paid to the layer characteristics when sprayed on wafers with cavities of various depths. A few applications of spray coating are shown to further illustrate its possibilities in MEMS.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nga Phuong Pham, Tom L.M. Scholtes, Ruud Klerk, Bernhard Wieder, Pasqualina M. Sarro, and Joachim N. Burghartz "Direct spray coating of photoresist for MEMS applications", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442960
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Cited by 11 scholarly publications.
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KEYWORDS
Semiconducting wafers

Coating

Photoresist materials

Microelectromechanical systems

Electroplating

Scanning electron microscopy

Photography

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