Abstract
Method of potentiodynamic polarization was used to study the electrodeposition of a copper-tin alloy from an oxalic acid electrolyte with addition of 10−5–10−3 mol dm−3 of trimethyloctylammonium chloride, N-octylpyridinium bromide, and N-benzylpyridinium bromide. Introduction of these compounds changes the rate of the cathodic reduction of tin. It was found that the nature and concentration of the additives introduced into the electrolyte affects the composition, structure, glossiness, and roughness of the Cu-Sn coatings being formed. It was shown that introduction into an electrolyte of trimethylammonium chloride and N-octylpyridinium bromide inhibits the deposition of tin and favors formation of lustrous and semilustrous coatings containing 24.4–35.8 wt % tin. The presence of N-benzylpyridinium bromide in an oxalic acid electrolyte intensifies the cathodic reduction of tin and leads to formation of matte coatings containing up to 42.5 wt % tin.
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Acknowledgments
The authors are grateful to V.S. Bezborodov, professor of the department of organic chemistry at the Belarussian State Technological University, for assistance in syntheses of quaternary ammonium salts examined in the study.
Funding
The study was financially supported by the Ministry of Education of the Republic of Belarus (grant “Electrochemical composite coatings with photocatalytic properties, based on tin alloys”).
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Russian Text © The Author(s), 2019, published in Zhurnal Prikladnoi Khimii, 2019, Vol. 92, No. 6, pp. 793–799.
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The authors state that they have no conflict of interest to be disclosed in this communication.
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Kasach, A.A., Kharitonov, D.S., Romanovskii, V.I. et al. Electrodeposition of Cu-Sn Alloy from Oxalic Acid Electrolyte in the Presence of Amine-containing Surfactants. Russ J Appl Chem 92, 835–841 (2019). https://doi.org/10.1134/S1070427219060144
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DOI: https://doi.org/10.1134/S1070427219060144