Abstract
We have studied the possibility of obtaining nickel-phosphorus coatings doped with copper (0.5–2 wt %) by chemical deposition from weakly acidic solutions containing nickel and copper salts and sodium hypophosphite, as well as malonic, succinic, and aminoacetic acids as complex-forming and buffering components, and a lead salt as the stabilizer at pH 6.3–7.0 and a temperature of 87–97°C. The solution composition has been optimized using the method of mathematical experiment planning so as to provide the deposition at a maximum rate.
Similar content being viewed by others
References
Shalkauskas, M. and Vashkyalis, A., Khimicheskaya metallizatsiya plastmass (Chemical Metallization of Plastics), Leningrad: Khimiya, 1977.
Lunyatskas, A.M. and Rachinskas, V.S., Method for Depositing Chemical Coatings, USSR Inventor’s Certificate no. 196512; Byul. Izobret., no. 11 (1967).
Lunyatskas, A.M. and Genoutene, I.K., Solution for Chemical Deposition of Nickel-Copper-Phosphorus Coatings, USSR Inventor’s Certificate no. 377444; Byul. Izobret., no. 18 (1973).
Starykh, S.E., Skopintsev, V.D., and Morgunov, A.V., Codeposition of Nickel, Phosphorus and Copper with Hypophosphite from Acid Solutions, Dokl. Tim. Sel.-Khoz. Akad., 2006, no. 278, pp. 589–593.
Author information
Authors and Affiliations
Additional information
Original Russian Text © M.B. Gokzhaev, A.V. Morgunov, V.D. Skopintsev, 2008, published in Neorganicheskie Materialy, 2008, Vol. 44, No. 12, pp. 1461–1463.
Rights and permissions
About this article
Cite this article
Gokzhaev, M.B., Morgunov, A.V. & Skopintsev, V.D. Optimizing solution composition for the chemical deposition of nickel-copper-phosphorus alloys. Inorg Mater 44, 1319–1321 (2008). https://doi.org/10.1134/S0020168508120108
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S0020168508120108