Skip to main content
SpringerLink
Log in

Adhesion of polyimide films to microelectronic article components

  • Macromolecular Chemistry and Polymeric Materials
  • Published:
Russian Journal of Applied Chemistry Aims and scope Submit manuscript

Abstract

Reactions between polypyromellitamido acid and component materials of microelectronic articles were examined by thermogravimetric analysis. Modes of modification of the surfaces of semiconductor structures to be used in formation of a system of interconnections with polyimide as interlayer insulator to obtain a high adhesion between the layers via their chemical reactions.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Bessonov, M.I., Koton, M.M., Kudryavtsev, V.V., and Laius, L.A., Poliimidy-klass termostoikikh polimerov (Polyimides: a Class of Thermostable Polymers), Leningrad: Nauka, 1983.

    Google Scholar 

  2. Harada, Yasoo, Matsumoto, Fumio, and Nakakado, Takashi, Solid State Science and Technology, 1983, vol. 130, no. 1, pp. 129–134.

    CAS  Google Scholar 

  3. Wilson, A.M., Thin Solid Films, 1981, vol. 83, no. 2, pp. 145–163.

    Article  CAS  Google Scholar 

  4. Sen’ko, S.F. and Snitovskii, Yu.P., Tr. Mezhnatsional’nogo soveshchaniya “Radiatsionnaya fizika tverdogo tela” (Proc. of XI Int. Workshop “Radiation Physics of Solid State”), Sevastopol’, June 25–30, 2001, Moscow, 2001, pp. 310–311.

  5. Lee, Y.K., Craig, J.D., and Pye, W.E., Proc., 4th Bien. Univ. Gov. Int. Microelectron. Symp., Starkville, 1981, New York, 1981, pp. 30–39.

  6. Yih, Jie, Ye, Yu-Feng, and Wang, Zong-Gvang, Europ. Polym. J., 1998, vol. 34, no. 12, pp. 1839–1843.

    Article  Google Scholar 

  7. Babaevskii, P.G., Zhukov, A.A., and Zhukova, S.A., Mikrosistem. Tekhn., 2004, no. 5, pp. 2–6.

  8. Snitovskii, Yu.P., Neorg. Mater., 2005, vol. 41, no. 8, pp. 922–927.

    Google Scholar 

  9. GOST (State Standard) 15140–78: Paint and Varnish Materials. Methods of Determination of Adhesion, Moscow: Izd. Standartov, 1978.

Download references

Author information

Authors and Affiliations

  1. Physicotechnical Institute, National Academy of Sciences of Belarus, State Scientific Establishment, Minsk, Belarus

    S. F. Sen’ko & Yu. P. Snitovskii

  2. Educational Establishment, Belarus State University of Informatics and Radioelectronics, Minsk, Belarus

    S. F. Sen’ko & Yu. P. Snitovskii

Authors
  1. S. F. Sen’ko
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yu. P. Snitovskii
    View author publications

    You can also search for this author in PubMed Google Scholar

Additional information

Original Russian Text © S.F. Sen’ko, Yu.P. Snitovskii, 2006, published in Zhurnal Prikladnoi Khimii, 2006, Vol. 79, No. 10, pp. 1701–1705.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Sen’ko, S.F., Snitovskii, Y.P. Adhesion of polyimide films to microelectronic article components. Russ J Appl Chem 79, 1681–1685 (2006). https://doi.org/10.1134/S1070427206100259

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1134/S1070427206100259

Keywords

Search

Navigation