A New Technique for the Formation of Ultrafine Particles by Sputtering

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Copyright (c) 1986 The Japan Society of Applied Physics
, , Citation Shigeki Yatsuya et al 1986 Jpn. J. Appl. Phys. 25 L42 DOI 10.1143/JJAP.25.L42

1347-4065/25/1A/L42

Abstract

A gas evaporation technique using sputtering is newly developed. The characteristic of this new technique is the use of sputtering in an atmosphere of higher gas pressure such as 0.5 to 100 Torr than is used for ordinary sputtering. W, Ag and Cu are tested and their ultrafine particles are formed. WC1-x particles are also prepared by reactive sputtering.

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10.1143/JJAP.25.L42