Abstract
The dependence of short-channel effects (SCEs) on the cross-sectional channel shape of the fin-type double-gate metal oxide semiconductor field-effect transistors (MOSFETs) has been experimentally investigated from the viewpoint of fin fabrication. The three types of fin-type double-gate MOSFETs (FinFETs) with a rectangular-cross-section channel on a (110)-oriented silicon-on-insulator (SOI) wafer, and a triangular and trapezoidal channels on a (100)-oriented SOI wafer were fabricated using the same orientation-dependent wet etching process. The experimental results show that the SCEs in rectangular-cross-section silicon (Si)-fin channel devices are well suppressed compared with those in a triangular or a trapezoidal Si-fin channel device fabricated using a similar mask pattern, in the regimes of the gate length of less than 85 nm and Si fin height of larger than 65 nm. The presented experimental results are valuable for FinFET design and fabrication.