Pulse‐Reverse Plating of Nanocomposite Thin Films

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© 1997 ECS - The Electrochemical Society
, , Citation E. J. Podlaha and D. Landolt 1997 J. Electrochem. Soc. 144 L200 DOI 10.1149/1.1837799

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1 Laboratoire de Métallurgie Chimique, Départment des Matériaux, Ecole Polytechnique Fédérale de Lausanne, CH‐1015 Lausanne, Switzerland

Dates

  1. Received 13 March 1997

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Abstract

A steady‐state pulse‐reverse plating method has been developed which permits the enhancement of the particle concentration in electrodeposited metal matrix composite coatings. The procedure is demonstrated for the codeposition of nanosized, γ‐alumina particles in a copper matrix.

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