Abstract
Finite element (FE) numerical simulation was employed for studying the influence of geometrical factors on the rate of leveling of a triangular surface profile during anodic dissolution in ECM at constant interelectrode gap under conditions of primary current distribution. Theoretical results were verified experimentally with a laboratory ECM apparatus using active dissolution of copper in 
as model reaction. The experimentally observed decrease with time of profile amplitude corresponds well to that predicted theoretically. At long dissolution times, experimental surface roughness does not reach zero, however, because microroughness develops due to crystallographic etching of the anode.