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Ylva Bäcklund1, Karin Hermansson1 and Leif Smith1
© 1992 ECS - The Electrochemical Society
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Citation Ylva Bäcklund et al 1992 J. Electrochem. Soc. 139 2299
DOI 10.1149/1.2221218
70 Total downloads
The hydrophilicity level of commonly used surface treatments prior to silicon fusion bonding has been measured and related to a resulting bond strength. The necessity of hydrophilic silicon surfaces to yield a strong bond has been questioned, even counter‐proved. The strongest bonds measured were for hydrophobic, 
wafers annealed at 800°C.
