Immersion Plating of the Platinum Group Metals

© 1961 ECS - The Electrochemical Society
, , Citation R. W. Johnson 1961 J. Electrochem. Soc. 108 632 DOI 10.1149/1.2428179

1945-7111/108/7/632

Abstract

Satisfactory immersion plating processes have been developed for the deposition of palladium, rhodium, ruthenium, and platinum up to thicknesses of 50, 30, 100, and 65 μ in., respectively. These coatings may be sealed by various means, including immersion in boiling water, in ammonium hydroxide, or in a replacement gold solution. Adherent coatings which provide useful wear‐resistance in addition to protection against tarnish and corrosion have been deposited on copper and certain copper alloys.

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10.1149/1.2428179