Abstract
This paper briefly summarizes selected developments that were marking progress in silicon cleaning technology over the last twenty years. The occasion for this review is a 10th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing organized under the auspices of the Electrochemical Society. This review considers general trends underlying the progress in cleaning technology, specific developments in the area of removal of various types of contaminants, as well as cleaning metrology. The concluding observation from this review is that the wafer cleaning technology is keeping up with increasing needs through continuous progress in all its facets. This progress will need to continue if the challenges resulting from increased complexity of device structures, new materials used, and the need to address environmental concerns are to be resolved.