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Interface material mixing formed by the deposition of copper on aluminum by means of the cold spray process

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Abstract

The objective of this article is to present microstructural evidence of a bonding mechanism between copper, which has been deposited by the cold spray process, and an aluminum substrate. Deposition conditions are varied to determine their effects on the nature of the bond. Mechanical measurements, such as adhesion strength and hardness, as well as visual methods are used to characterize the process. A ballistic model is proposed to explain the process.

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Authors and Affiliations

  1. U.S. Army Research Laboratory, Weapons and Materials Research Directorate, Aberdeen Proving Ground, 21005-5069, MD

    Victor K. Champagne Jr., Dennis Helfritch, Phillip Leyman, Scott Grendahl & Brad Klotz

Authors
  1. Victor K. Champagne Jr.
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  2. Dennis Helfritch
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  3. Phillip Leyman
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  4. Scott Grendahl
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  5. Brad Klotz
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Champagne, V.K., Helfritch, D., Leyman, P. et al. Interface material mixing formed by the deposition of copper on aluminum by means of the cold spray process. J Therm Spray Tech 14, 330–334 (2005). https://doi.org/10.1361/105996305X59332

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  • DOI: https://doi.org/10.1361/105996305X59332

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