Abstract
Polyimides are a sophisticated family of materials, which cover an exhaustive range of high performance polymers and find applications from aerospace to microelectronics. Microelectronic applications demand low dielectric constant and high performance. Aromatic terpolyimides were synthesized by reacting 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) with 4,4′-oxydianiline (ODA) by thermal imidization with the view to decrease their dielectric constant without compromising thermal properties and mechanical properties compared to their homo and copolyimides. They were characterized by Fourier transform infrared spectroscopy (FTIR), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and X-ray diffraction (XRD). Their FTIR spectra established formation of polyimide by the characteristic vibrations at 1375 cm-1 (C-N stretch) and 1113 cm-1 (imide ring deformation). The TGA results showed decomposition of imides at about 515°C. The glass transition temperature (Tg) of the polymers varied from 261°C to 281°C. The XRD spectrum of BPDA/BTDA/6FDA-ODA, which contained 50% of 6FDA, showed a broadened envelope with a peak at 16.8° (2θ), illustrating a semicrystalline nature. Incorporation of 6FDA, with a bulky bridging group into the backbone of BPDA/6FDA-ODA and BPDA/BTDA/6FDA-ODA (0.25:0.25:0.5::1) caused a decrease in the dielectric constant (2.13 and 2.38, respectively). Such polyimides can find application in microelectronics such as flexible printed circuits and tape automated bonding applications.
Acknowledgments
The authors are grateful to B.S. Abdur Rahman University for financial support. The technical support of Mr. Selvam, Anjan Chemicals, for FTIR, Dr. S. Rajendran and Dr. M. S. Pandian, Pondicherry University for XRD, Mr. Rohan Bosale, Hemetek Technologies for tensile properties, Dr. R. Vasanthakumari, B.S. Abdur Rahman University for DSC and TGA, and Dr. V. Geethaguru, Dr. M. Murugan, Mr. K. Gunasekar, Mr. T. Kannakaraj and Mr. R. Tamilselvan, B.S. Abdur Rahman University for their support in fabricating the solution casting machine and thickness measurements are greatly appreciated. Ms. H. Sofia is kindly acknowledged for correcting the English.
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