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Wetting and interface microstructure between Sn–Zn binary alloys and Cu

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Abstract

Sn–Zn binary alloys have been examined as a lead-free solder. Zn distributes in a Sn matrix as platelets. The hypoeutectic alloys show two endothermic peaks in DTA, which correspond to the eutectic and the liquidus temperatures. Three reaction layers are formed at the Sn–Zn/Cu interface without containing Sn: the thick γ–Cu5Zn8 adjacent to the solder, the thin β′–CuZn in the middle, and the thinnest layer adjacent to Cu. Although many nonwetting regions and voids are formed at the interface because of poor wetting, soldering at 290 °C can form a rigid interface, and tensile strength reaches about 40 MPa.

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Authors and Affiliations

  1. Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, 567, Ibaraki, Osaka, Japan

    Katsuaki Suganuma & Koichi Niihara

  2. Department of Materials Science and Engineering, National Defense Academy, Hashirimizu 1-10-20, 239, Yokosuka, Kanagawa, Japan

    Takeshi Shoutoku & Yoshikazu Nakamura

Authors
  1. Katsuaki Suganuma
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  2. Koichi Niihara
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  3. Takeshi Shoutoku
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  4. Yoshikazu Nakamura
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Corresponding author

Correspondence to Katsuaki Suganuma.

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Suganuma, K., Niihara, K., Shoutoku, T. et al. Wetting and interface microstructure between Sn–Zn binary alloys and Cu. Journal of Materials Research 13, 2859–2865 (1998). https://doi.org/10.1557/JMR.1998.0391

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  • DOI: https://doi.org/10.1557/JMR.1998.0391

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