Abstract
Nanoindentation is a technique commonly used for measuring thin film mechanical properties such as hardness and stiffness. In this study, we used the finite element method to investigate the effect of substrate and pileup on hardness and stiffness measurements of thin film systems. We define a substrate effect factor and construct a map that may be useful in the interpretation of indentation measurements when it is not possible to make indentations shallow enough to avoid the influence of the substrate on the measurements. A new technique for measuring mechanical properties of thin films by nanoindentation is suggested at the end of this article.
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References
W.C. Oliver and G.M. Pharr, J. Mater. Res. 7, 1564 (1992).
T.Y. Tsui, J.J. Vlassak, and W.D. Nix, J. Mater. Res. 14, 2196 (1999).
T.Y. Tsui, J.J. Vlassak, and W.D. Nix, J. Mater. Res. 14, 2204 (1999).
Standard Test Method for Vickers Hardness of Metallic Materials (American Society for Testing and Materials, West Con-shohocken, PA, 1987).
J.J. Vlassak and W.D. Nix, Philos. Mag. A 67, 1045 (1993).
J.J. Vlassak and W.D. Nix, J. Mech. Phys. Solids 42, 1223 (1994).
K.L. Johnson, Contact Mechanics (Cambridge University Press, Cambridge, 1985).
R.B. King, Int. J. Solids Struct. 23, 1657 (1987).
H.Y. Yu, S.C. Sanday, and B.B. Rath, J. Mech. Phys. Solids 38, 745 (1990).
H. Gao, C-H. Chiu, and J. Lee, Int. J. Solids Struct. 29, 2471 (1992).
T.A. Larsen and J.C. Simo, J. Mater. Res. 7, 618 (1992).
T.Y. Tsui, W.C. Oliver, and G.M. Pharr, in Thin Films: Stresses and Mechanical Properties VI, edited by W.W. Gerberich, H. Gao, J-E. Sundgren, and S.P. Baker (Mater. Res. Soc. Symp. Proc. 436, Pittsburgh, PA, 1996), p. 207.
T.Y. Tsui, C.A. Ross, and G.M. Pharr, in Materials Reliability in Microelectronics VII, edited by J.J. Clement, R.R. Keller, K.S. Krisch, J.E. Sanchez Jr., and Z. Suo (Mater. Res. Soc. Symp. Proc. 473, Pittsburgh, PA, 1997), p. 51.
J.C. Hay and G.M. Pharr, in Thin Films: Stresses and Mechanical Properties VII, edited by R.C. Cammarato, M.A. Nastasi, E.P. Busso, and W.C. Oliver (Mater. Res. Soc. Symp. Proc. 505, Warrendale, PA, 1998), p. 71.
A.K. Bhattacharya and W.D. Nix, Int. J. Solids Structures 24, 1287 (1988).
M.R. McGurk, H.W. Chandler, P.C. Twigg, and T.F. Page, Surf. Coat. Technol. 68, 576 (1994).
M.R. McGurk and T.F. Page, Surf. Coat. Technol. 92, 87 (1997).
A.M. Korsunsky, M.R. McGurk, S.J. Bull, and T.F. Page, Surf. Coat. Technol. 99, 171 (1998).
S.D. Mesarovic and N.A. Fleck, Proc. R. Soc. Lond. 455, 2707 (1999).
Hibbit, Karlsson and Sorenson Inc., ABAQUS Version 5.8 User’s Manual (Pawtucket, RI, 1999).
K.W. McElhaney, J.J. Vlassak, and W.D. Nix, J. Mater. Res. 13, 1300 (1998).
J.W. Harding and I.N. Sneddon, Proc. Cambridge Philos. Soc. 14, 16 (1945).
J.C. Hay, A. Bolshakov, and G.M. Pharr, J. Mater. Res. 14, 2296 (1999).
R. Bhadra, M. Grimsditch, I.K. Schuller, and F. Nizzoli, Phys. Rev. B39, 12456 (1989).
M.G. Beghi, C.E. Bottani, P.M. Ossi, T.A. Lafford, and B.K. Tanner, J. Appl. Phys. 81, 672 (1997).
A.J. Kalkman, A.H. Verbruggen, G.C.A.M. Janssen, and F.H. Groen, Rev. Sci. Instrum. 70, 4026 (1999).
A.J. Kalkman, A.H. Verbruggen, and G.C.A.M. Janssen, Appl. Phys. Lett. 78, 2673 (2001).
T. Kawai, B.M. Ma, S.G. Sankar, and W.E. Wallace, J. Appl. Phys. 67, 4610 (1990).
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Chen, X., Vlassak, J.J. Numerical study on the measurement of thin film mechanical properties by means of nanoindentation. Journal of Materials Research 16, 2974–2982 (2001). https://doi.org/10.1557/JMR.2001.0408
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DOI: https://doi.org/10.1557/JMR.2001.0408