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Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

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Abstract

The microstructure and adhesion strength of the Sn-0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn-3.5Ag alloy, the Sn-0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular η-phase grew into a round and scallop-shaped morphology, thin є(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.

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References

  1. S.K. Kang and A.K. Sarkhel, J. Electron. Mater. 23d, 701 (1994).

    Article  Google Scholar 

  2. I. Shohji, S. Fujiwara, S. Kiyono, and K.F. Kobayashi, Scirpta Mat. 40, 815 (1999).

    Article  CAS  Google Scholar 

  3. W. Yang, L.E. Felton, and R.W. Messler Jr., J. Electron. Mater. 24, 1465 (1995).

    Article  CAS  Google Scholar 

  4. D.R. Flanders, E.G. Jacobs, and R.F. Pinizzotto, J. Electron. Mater. 26, 701 (1997).

    Article  Google Scholar 

  5. J. Sigelko, S. Choi, K.N. Subranamian, J.P. Lucas, and T.R. Bieler, J. Electron. Mater. 28, 1184 (1999).

    Article  CAS  Google Scholar 

  6. B. Trumble, IEEE Spectrum 35, 55, (May 1998).

    Article  Google Scholar 

  7. J. May and J.W. Morris, J. Electron. Mater. 21, 599 (1992).

    Article  Google Scholar 

  8. M. Schaefer, R.A. Fournelle, and J. Liang, J. Electron. Mater. 27, 1167 (1998).

    Article  CAS  Google Scholar 

  9. S-W. Chen and Y-W. Chen, J. Electron. Mater. 28, 1203 (1999).

    Article  CAS  Google Scholar 

  10. K.N. Tu, Acta Metall. 21, 347 (1973).

    Article  CAS  Google Scholar 

  11. S. Chada, R.A. Fournelle, W. Laub, and D. Shangguan, J. Electron. Mater. 29, 1214 (2000).

    Article  CAS  Google Scholar 

  12. T. Laine-Ylijoki, H. Steen, and A. Forsten, IEEE Trans.-CPMT Part C,20, 194 (1997)

    Google Scholar 

  13. K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda, J. Mater. Res. 15, 884 (2000).

    Article  CAS  Google Scholar 

  14. W.J. Plumbridge and C.R. Gagg, J. Mater. Sci. 10, 461 (1999).

    CAS  Google Scholar 

  15. J.W. Jang, C.Y. Liu, P.G. Kim, K.N. Tu, A.K. Mal, and D.R. Frear, J. Mater. Res. 15, 1679 (2000).

    Article  CAS  Google Scholar 

  16. S. Yu, M. Wang, and M. Hon, J Mater. Res. 16, 76 (2001).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Department of Electronic Materials Engineering, The University of Suwon, 445-743, Suwon, Kyunggi-do, Korea

    Kyoo-Sik Bae & Si-Jung Kim

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  1. Kyoo-Sik Bae
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  2. Si-Jung Kim
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Bae, KS., Kim, SJ. Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints. Journal of Materials Research 17, 743–746 (2002). https://doi.org/10.1557/JMR.2002.0108

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  • DOI: https://doi.org/10.1557/JMR.2002.0108

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