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Improving sol-gel Yba2Cu3O7−δ film morphology using high-boiling-point solvents

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Abstract

The effect of high-boiling-point solvent addition on the morphology of low-p(O2) processed, sol-gel YBa2Cu3O7−δ (YBCO) films is discussed. Proper selection and addition of a high-boiling-point solvent prevents film roughening during precursor pyrolysis, while permitting at least a tenfold reduction in pyrolysis time compared to standard film processing in air or O2. Use of such solvents appears to increase film plasticity, avoiding elastic compressive stress related buckling. High-quality YBCO films on 〈100〉 LaAlO3 with a critical current density (Jc) ∼ 3–4 MA/cm2 at 77 K, are routinely crystallized with this new sol-gel process. Diethanolamine-based, sol-gel YBCO films deposited on sol-gel SrTiO3-buffered 〈100〉 Ni have Jc(77 K) > 1 MA/cm2, demonstrating a route toward all-sol-gel superconducting wires.

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Authors and Affiliations

  1. Sandia National Laboratories, Albuquerque, New Mexico, 87185, Mexico

    J. T. Dawley, P. G. Clem, M. P. Siegal, D. R. Tallant & D. L. Overmyer

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  1. J. T. Dawley
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  2. P. G. Clem
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  3. M. P. Siegal
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  4. D. R. Tallant
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  5. D. L. Overmyer
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Dawley, J.T., Clem, P.G., Siegal, M.P. et al. Improving sol-gel Yba2Cu3O7−δ film morphology using high-boiling-point solvents. Journal of Materials Research 17, 1900–1903 (2002). https://doi.org/10.1557/JMR.2002.0282

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  • DOI: https://doi.org/10.1557/JMR.2002.0282

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