Abstract
The reaction between Sn–xCu (x = 0.1, 0.3, 0.7, 0.9, and 1.5 wt%) solder alloys and Ni at 260, 280, and 290 °C for 60 s was studied to reveal the effect of Cu content on the composition and morphology of intermetallic compounds (IMCs) formed at the interface between solder and substrate. The results indicated that Cu concentration greatly affects both the composition and morphology of the IMC between the solder and Ni substrate. In particular, when the Cu concentration was less than or equal to 0.3 wt%, (CuxNi1−x)3Sn4 IMCs were formed at the interface. When the Cu concentration was 0.7 wt%, large facets type of (CuxNi1−x)6Sn5 were mixed with (CuxNi1−x)3Sn4 in the IMC layer. At Cu concentrations higher than the eutectic one, e.g., 0.9 and 1.5 wt%, stick-shaped (CuxNi1−x)6Sn5 compounds were detected, but the (CuxNi1−x)3Sn4 IMCs disappeared. The formation and growth mechanism of the (CuxNi1−x)6Sn5 compound were analyzed. The evolution tendency of the composition and morphology of the IMCs at the three testing temperatures was found to be the same.
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References
M. Abtew and G. Selvaduray: Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95 (2000).
C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang: Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng. R 44, 1 (2004).
K.N. Tu and K. Zeng: Tin–lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1 (2001).
E. Saiz, C.W. Hwang, K. Suganuma, and A.P. Tomsia: Spreading of Sn–Ag solders on FeNi alloys. Acta Mater. 51, 3185 (2003).
W.T. Chen, C.E. Ho, and C.R. Kao: Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders. J. Mater. Res. 17, 263 (2002).
C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao: Effect of Cu concentration on the reactions between Sn–Ag–Cu solders and Ni. J. Electron. Mater. 31, 584 (2002).
D.Q. Yu, L. Wang, C.M.L. Wu, and C.M.T. Law: The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction. J. Alloys Compd. 389, 153 (2005).
T. Laurila, V. Vuorinen, and J.K. Kivilahti: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, (2005).
X.F. Bian, P.X. Min, X.B. Qin, and M.H. Jang: Medium-range order clusters in metal melts. Sci. China (E) 32, 145 (2002).
S.C. Hsu, S.J. Wang, and C.Y. Liu: Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization. J. Electron. Mater. 32, 1214 (2003).
S.J. Wang and C.Y. Liu: Study of interaction between Cu–Sn and Ni–Sn interfacial reactions by Ni–Sn3.5Ag–Cu sandwich structure. J. Electron. Mater. 32, 1303 (2003).
D.Q. Yu, C.M.L. Wu, C.M.T. Law, and L. Wang: Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method. J. Alloys Compd. 392, 192 (2005).
J.W. Yoon, S.W. Kin, and S.B. Jung: Effect of reflow time on interfacial reaction and shear strength of Sn–0.7Cu solder/Cu and electroless Ni–P BGA joints. J. Alloys Compd. 385, 192 (2004).
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Yu, D.Q., Wu, C.M.L., He, D.P. et al. Effects of Cu contents in Sn–Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface. Journal of Materials Research 20, 2205–2212 (2005). https://doi.org/10.1557/JMR.2005.0275
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DOI: https://doi.org/10.1557/JMR.2005.0275