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Creep characteristics of alumina, nickel aluminate spinel, zirconia composites

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Abstract

Fine grained, three-phase ceramic composites that exhibit favorable toughness, hardness, and high room-temperature strength were evaluated for high-temperature mechanical stability. A 50vol%Al2O3–25vol%NiAl2O4–25vol%3 mol%yttria-stabilized tetragonal zirconia polycrystal (3Y–TZP) and a 33vol%Al2O3–33vol%NiAl2O4–33vol%3Y-TZP composite were compression creep tested at temperatures between 1350 and 1450 °C under constant stresses of 20–45 MPa. The three-phase microstructure effectively limited grain growth (average d0 = 1.3 μm, average df = 1.6 μm after 65% true strain). True strain rates were 10−4 to 10−6 s−1 with stress exponents n = 1.7 to 1.8 and a grain-size exponent p = 1.3. A method for compensating for grain growth is presented using stress jump tests. The apparent activation energy for high-temperature deformation for 50vol%Al2O3–25vol%NiAl2O4–25vol%3Y–TZP was found to be 373 kJ/mol-K.

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Acknowledgments

R.P. Dillon, J.E. Trujillo, and M.L. Mecartney are supported by the National Science Foundation under Grant Nos. DMR-0207197 and DMR-0606063. D-K. Kim is partially supported by the Air Force Office of Scientific Research under Grant No. F49620-03-1-0082. J.E. Trujillo is supported by University of California Leadership Excellence through Advanced Degrees (UC-LEADS).

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Authors and Affiliations

  1. Department of Chemical Engineering and Materials Science, University of California, Irvine, Irvine, California, 92697-2575, USA

    R. Peter Dillon, Joy E. Trujillo & Martha L. Mecartney

  2. Department of Materials Science and Engineering, University of Illinois at Urbana–Champaign, Urbana, Illinois, 61801, USA

    Dong-Kyu Kim & Waltraud M. Kriven

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  1. R. Peter Dillon
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  2. Dong-Kyu Kim
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  5. Martha L. Mecartney
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Correspondence to Martha L. Mecartney.

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Dillon, R.P., Kim, DK., Trujillo, J.E. et al. Creep characteristics of alumina, nickel aluminate spinel, zirconia composites. Journal of Materials Research 23, 556–564 (2008). https://doi.org/10.1557/JMR.2008.0071

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  • DOI: https://doi.org/10.1557/JMR.2008.0071

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