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Relationship between scratch hardness and yield strength of elastic perfectly plastic materials using finite element analysis

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Abstract

With thin solid film usage expanding in numerous technologies, reliable measurements of material properties such as yield strength become important. However, for thin solid films the measurement of yield strength is not readily available, and an alternative method to obtain this property is to measure hardness and convert it to yield strength. Tabor suggested dividing hardness by ∼3 to obtain yield strength, which has been used extensively, despite its shortcomings. Since the pioneering work of Tabor, researchers have performed numerical and experimental studies to investigate the relationships between hardness, yield strength, and elastic modulus, using the indentation technique. In this study, finite element analysis was performed to simulate the nanoscratch technique. Specifically, the nanoscratch finite element analysis was used to validate a previously developed analytical scratch hardness model. A full-factorial design-of-experiments was performed to determine the significant variables for the ratio of calculated scratch hardness to yield strength and a simple analytical prediction model for the ratio of hardness to yield strength was proposed.

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Acknowledgments

This research was supported by grants from the Information Storage Industry Consortium (INSIC) Extremely High Density Recording (EHDR) Program and the National Science Foundation under grant number CAREER CMS-0239232. Also, this work was supported by the National Center for Supercomputing Applications under TG-MSS05005N and used the IBM P690 (Copper) computing resources (where all the FEA simulations using ABAQUS were performed).

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Lee, K.M., Yeo, CD. & Polycarpou polycarp@uiuc.edu, A.A. Relationship between scratch hardness and yield strength of elastic perfectly plastic materials using finite element analysis. Journal of Materials Research 23, 2229–2237 (2008). https://doi.org/10.1557/JMR.2008.0279

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  • DOI: https://doi.org/10.1557/JMR.2008.0279

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