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Strain and Texture in Al-Interconnect Wires Weasured by X-Xay Microbeam Diffraction

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Abstract

The local strain and texture in Al interconnect wires have been investigated using white and monochromatic x-ray microbeams on the MHATTCAT undulator beam line at the Advanced Photon Source. Intergrain and intragrain orientations were obtained with ~0.01° sensitivity using white beam measurements on wide Al pads (~100 ώm) and thin (2 ώm) Al wires. Orientation changes of up to 1°were found within individual grains of the (111) textured Al interconnects. Deviatoric strain measurements indicate small intragranular strain variations, but intergranular strain variations were found to be quite large.

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Authors and Affiliations

  1. Oak Ridge National Laboratory, Oak Ridge, TN, USA

    Nobumichi Tamura, J. S. Chung, G. E. Ice, B. C. Larson, J. D. Budai, J. Z. Tischler & M. Yoon

  2. Howard University, Washington, D.C, USA

    E. L. Williams & W. P. Lowe

Authors
  1. Nobumichi Tamura
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  2. J. S. Chung
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  3. G. E. Ice
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  4. B. C. Larson
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  5. J. D. Budai
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  6. J. Z. Tischler
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  7. M. Yoon
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  8. E. L. Williams
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  9. W. P. Lowe
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Tamura, N., Chung, J.S., Ice, G.E. et al. Strain and Texture in Al-Interconnect Wires Weasured by X-Xay Microbeam Diffraction. MRS Online Proceedings Library 563, 175–180 (1999). https://doi.org/10.1557/PROC-563-175

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  • DOI: https://doi.org/10.1557/PROC-563-175

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