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Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu “bimetal ledge specimen”

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Abstract

Sn whisker formation was studied in a “bimetal ledge specimen” that consisted of a uniform layer of Sn that was covered by Cu on only half the sample. Whiskers are observed to grow in the Cu-free region of the sample, which is attributed to stress generated by the diffusion of Sn atoms along the network of columnar grain boundaries. The Sn diffusion is driven by the intermetallic growth, but the whisker density extends out much further than any measurable Cu concentration. Whiskers were also observed to grow in the Cu-coated region by punching through the overlayer, leaving a Cu-grain on the tip of the Sn whisker.

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Authors and Affiliations

  1. Division of Engineering, Brown University, Providence, Rhode Island, 02912

    Lucine Reinbold, Nitin Jadhav, Eric Chason & K. Sharvan Kumar

  2. Raytheon Company IDS, Seapower Capability Center, Portsmouth, Rhode Island, 02871

    Lucine Reinbold

Authors
  1. Lucine Reinbold
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  2. Nitin Jadhav
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  3. Eric Chason
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  4. K. Sharvan Kumar
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Correspondence to K. Sharvan Kumar.

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Reinbold, L., Jadhav, N., Chason, E. et al. Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn-Cu “bimetal ledge specimen”. Journal of Materials Research 24, 3583–3589 (2009). https://doi.org/10.1557/jmr.2009.0431

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  • DOI: https://doi.org/10.1557/jmr.2009.0431

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