Abstract
For Sn–Pb eutectic solder alloy, uniaxial tensile tests were conducted to dog-bone type specimens annealed at different temperatures (60–180 °C) and durations (2–48 h). Low strain rates ranging from 10−4 s−1 to 10−3 s−1 were applied to study the competition between creep and plasticity and also the rate dependent effect of annealing condition. It is found that the influence of annealing temperature on material properties is more than that of annealing duration. Higher temperature up to 180 °C generally leads to higher yield and ultimate stresses and ultimate strain of annealed specimens. The optimal annealing condition is suggested to be 180 °C for 6 h for stable and efficient improvements in both strength and ductility. By proposing a concise unified creep and plasticity constitutive model, the sensitivity to strain rate and annealing condition is quantified with consideration of both creep and hardening properties. Parameter calibration theoretically confirms the observed optimal annealing condition in experiments.
Similar content being viewed by others
References
M. Osterman: Being “RoHS Exempt” in a Pb-free world. Presented at the Capital SMTA Chapter Pb-free Tutorial Program (Electronic Products and Systems Center, Maryland, 2006).
Directive EU: European Parliament legislative resolution of 24 November 2010 on the proposal for a directive of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment A7–0196/2010 (2010).
I.C. Turner, B.D. Dunn, and C. Barnes: A study into the re-processing of pure tin termination finishes into tin–lead. Soldering Surf. Mt. Tech. 25(4), 218 (2013).
B.D. Dunn and G. Mozdzen: Tin oxide coverage on tin whisker surfaces, measurements and implications for electronic circuits. Soldering Surf. Mt. Tech. 26(3), 139 (2014).
ECSS-Q-ST-70–08C: Space Product Assurance: The Manual Soldering of High-reliability Electrical Connections (European Cooperation for Space Standardization, Noordwijk, 2009).
ECSS-Q-ST-70–38C: Space Product Assurance, High-reliability Soldering for Surface-mount and Mixed Technology (European Cooperation for Space Standardization, Noordwijk, 2008).
A. Rusinko: Modeling the effect of DC on the creep of metals in terms of the synthetic theory of irrecoverable deformation. Mech. Mater. 93, 163 (2016).
G. Chen and X. Chen: Fatigue damage coupled constitutive model for 63Sn37Pb solder under proportional and non-proportional loading. Mech. Mater. 39(1), 11 (2007).
M. Mustafa, J.C. Suhling, and P. Lall: Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. Microelectron. Reliab. 56, 136 (2015).
F. Ochoa, J.J. Williams, and N. Chawla: Effects of cooling rate on the microstructure and tensile behavior of a Sn–3.5 wt% Ag solder. J. Electron. Mater. 32(32), 1414 (2003).
X. Hu, W. Chen, X. Yu, Y. Li, Y. Liu, and Z. Min: Shear strengths and fracture behaviors of Cu/Sn37Pb/Cu soldered joints subjected to different displacement rates. J. Alloys Compd. 600, 13 (2014).
K.S. Kim, S.H. Huh, and K. Suganuma: Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys. Mater. Sci. Eng., A 333(1–2), 106 (2002).
P. Vianco, J. Rejent, G. Zender, and A. Kilgo: Kinetics of Pb-rich phase particle coarsening in Sn–Pb solder under isothermal annealing–cooling rate dependence. J. Mater. Res. 20(6), 1563 (2005).
T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K. Zeng, and J.K. Kivilahti: Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17(2), 291 (2002).
K.I. Ohguchi and K. Kurosawa: An evaluation method for tensile characteristics of Cu/Sn IMCs using miniature composite solder specimen. J. Electron. Mater. 45(6), 3183 (2016).
C.M. Chuang, T.S. Lui, and L.H. Chen: Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder. J. Mater. Res. 16(9), 2644 (2001).
K. Jung and H. Conrad: Microstructure coarsening during static annealing of 60Sn40Pb solder joints: I stereology. J. Electron. Mater. 30(10), 1294 (2001).
L.N. Ramanathan, J.W. Jang, J.K. Lin, and D.R. Frear: Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy. J. Electron. Mater. 34(10), L43 (2005).
J-W. Jang, A.P. De Silva, J-K. Lin, and D.R. Frear: Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps. J. Mater. Res. 19(6), 1826 (2004).
Y. Xu, S. Ou, K.N. Tu, K. Zeng, and R. Dunne: Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester. J. Mater. Res. 23(5), 1482 (2008).
K. Kawashima, T. Ito, and M. Sakuragi: Strain-rate and temperature-dependent stress–strain curves of Sn–Pb eutectic alloy. J. Mater. Sci. 27(23), 6387 (1992).
H. Nose, M. Sakane, Y. Tsukada, and H. Nishimura: Temperature and strain rate effects on tensile strength and inelastic constitutive relationship of Sn–Pb solders. J. Electron. Packag. 125(1), 59 (2003).
I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki: Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder. J. Mater. Sci.: Mater. Electron. 15(4), 219 (2004).
I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki: Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity. Mater. Sci. Eng., A 366(1), 50 (2004).
L. Zhang, X. Chen, H. Nose, and M. Sakane: Stress–strain behaviors of 63Sn37Pb solder simulated by anand model. J. Mech. Strength 26(4), 447 (2004).
X. Chen, D. Jin, M. Sakane, and T. Yamamoto: Multiaxial low-cycle fatigue of 63Sn–37Pb solder. J. Electron. Mater. 34(1), L1 (2005).
R. Chen and F. Yang: Electrocontact heating in a Sn60Pb40 solder alloy. J. Phys. D: Appl. Phys. 41(41), 3142 (2008).
R. Chen and F. Yang: Impression creep of a Sn60Pb40 alloy: The effect of electric current. J. Phys. D: Appl. Phys. 41(15), 1525 (2008).
F.Z. Xuan, S.S. Shao, and Q.Q. Chen: Synthesis creep behavior of Sn63Pb37 under the applied stress and electric current. Microelectron. Reliab. 51(12), 2336 (2011).
T. Hurtony, A. Szakál, L. Almásy, A. Len, S. Kugler, A. Bonyár, and P. Gordon: Characterization of the microstructure of tin–silver lead free solder. J. Alloys Compd. 672, 13 (2016).
W. Yang, L.E. Felton, and R.W. Messler: The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn–Ag/Cu solder joints. J. Electron. Mater. 24(10), 1465 (1995).
K.M. Kumar, V. Kripesh, and A.A.O. Tay: Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy. J. Alloys Compd. 455(1–2), 148 (2008).
X. Wang, D. Xu, H. Liu, H. Zhou, Y. Mai, J. Yang, and E. Li: Effects of thermal residual stress on interfacial properties of polyphenylene sulphide/carbon fibre (PPS/CF) composite by microbond test. J. Mater. Sci. 51(1), 334 (2016).
Annual Book of ASTM Standards: Standard Test Methods for Tension Testing of Metallic Materials (American Association State, Pennsylvania, 2009).
D.L. McDowell, M.P. Miller, and D.C. Brooks: A unified creep-plasticity theory for solder alloys. In Fatigue of Electronic Materials. (ASTM International, Philadelphia, 1994).
Y. Yao, L.M. Keer, and M.E. Fine: Modeling the failure of intermetallic/solder interfaces. Intermetallics 18(8), 1603 (2010).
Y. Yao, H. Xu, L.M. Keer, and M.E. Fine: A continuum damage mechanics-based unified creep and plasticity model for solder materials. Acta Mater. 83, 160 (2015).
Dassault Systemes Simulia Corp.: ABAQUS 6.14–4 (Hibbitt, Karlsson & Sorensen, Rhode Island, 2014).
ACKNOWLEDGMENTS
The authors are grateful for the supports provided by National Natural Science Foundation of China (51508464, 11572249). This work was also partially supported by “the Fundamental Research Funds for the Central Universities” (No. 3102016ZY017).
Author information
Authors and Affiliations
Corresponding authors
Rights and permissions
About this article
Cite this article
Long, X., Wang, S., He, X. et al. Annealing optimization for tin–lead eutectic solder by constitutive experiment and simulation. Journal of Materials Research 32, 3089–3099 (2017). https://doi.org/10.1557/jmr.2017.166
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/jmr.2017.166