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The Development and Commercialization of Lead-Free Soldering

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References

  1. Lead-Free Solder Project Final Report, NCMS Report 0401RE96 (National Center for Manufacturing Sciences, Ann Arbor, MI, 1997).

  2. Lead-Free Solder Working Report on High-Bi Solders (JIEP Lead-Free Solder Working Group, Osaka, 1997).

  3. M.R. Harrison and J.H. Vincent, in Proc. 12th Microelectronics and Packaging Conf. (IMAPS Europe, Cambridge, 1999) p. 8.

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  4. NEDO Research and Development on Lead-Free Soldering, Report No. 00-ki-17 (Japan Electronics Industry Development Association, Tokyo, 2000).

  5. Project Symposium on Research and Development on Lead-Free Soldering for Standardization (Japan Welding Engineering Society, Tokyo, 2000).

  6. Proc. Symp. on the Promotion of Sn-Zn Lead-Solder (Japan Institute of Electronics Packaging, Tokyo, 2001).

  7. K. Suganuma, Curr. Opin. Solid State Mater. 5 (1) (2001) p. 555.

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Authors
  1. Katsuaki Suganuma
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Suganuma, K. The Development and Commercialization of Lead-Free Soldering. MRS Bulletin 26, 880–884 (2001). https://doi.org/10.1557/mrs2001.228

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